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Elsyca has developed a dynamically software controlled electroplating tooling concept (Elsyca IntelliTool) that allows to plate more complex and changing patterns faster and more uniform. The main change from a standard cell is the introduction of a controllable matrix of inert anode rods, at a short distance of the substrate.
A first industrial machine implementing the Elsyca IntelliTool approach has been installed at Eurocircuits Baesweiler (Germany). The aim is to improve the uniformity and/or deposition speed of copper electrodeposition on printed circuit boards.
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